TJA1081TS,118
vs
935261511005
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SSOP1
DIE
Package Description
5.30 MM, PLASTIC, MO-150, SOT338-1, SSOP-16
DIE,
Pin Count
16
15
Manufacturer Package Code
SOT338-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
56 Weeks, 1 Day
Samacsys Manufacturer
NXP
Data Rate
10000 Mbps
JESD-30 Code
R-PDSO-G16
R-XUUC-N15
JESD-609 Code
e4
Length
6.2 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
16
15
Number of Transceivers
1
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
SSOP
DIE
Package Equivalence Code
SSOP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
UNCASED CHIP
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Screening Level
AEC-Q100
Seated Height-Max
2 mm
Supply Current-Max
0.037 mA
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Telecom IC Type
INTERFACE CIRCUIT
INTERFACE CIRCUIT
Terminal Finish
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
Terminal Position
DUAL
UPPER
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
5.3 mm
Base Number Matches
1
1
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