TJA1081TS,118 vs 935261511005 feature comparison

TJA1081TS,118 NXP Semiconductors

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935261511005 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SSOP1 DIE
Package Description 5.30 MM, PLASTIC, MO-150, SOT338-1, SSOP-16 DIE,
Pin Count 16 15
Manufacturer Package Code SOT338-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 56 Weeks, 1 Day
Samacsys Manufacturer NXP
Data Rate 10000 Mbps
JESD-30 Code R-PDSO-G16 R-XUUC-N15
JESD-609 Code e4
Length 6.2 mm
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 16 15
Number of Transceivers 1
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SSOP DIE
Package Equivalence Code SSOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH UNCASED CHIP
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Screening Level AEC-Q100
Seated Height-Max 2 mm
Supply Current-Max 0.037 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Terminal Finish Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm
Terminal Position DUAL UPPER
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 5.3 mm
Base Number Matches 1 1

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