TIBPAL20L10-20CJT
vs
PAL16R8-7VC
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NATIONAL SEMICONDUCTOR CORP
Package Description
DIP, DIP24,.3
QCCJ, LDCC20,.4SQ
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Architecture
PAL-TYPE
PAL-TYPE
JESD-30 Code
R-GDIP-T24
S-PQCC-J20
Number of Dedicated Inputs
12
8
Number of I/O Lines
8
Number of Inputs
20
8
Number of Outputs
10
8
Number of Product Terms
40
64
Number of Terminals
24
20
Operating Temperature-Max
75 °C
75 °C
Operating Temperature-Min
Organization
12 DEDICATED INPUTS, 8 I/O
8 DEDICATED INPUTS, 0 I/O
Output Function
COMBINATORIAL
REGISTERED
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
QCCJ
Package Equivalence Code
DIP24,.3
LDCC20,.4SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programmable Logic Type
OT PLD
OT PLD
Propagation Delay
20 ns
7 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
TTL
Temperature Grade
COMMERCIAL EXTENDED
COMMERCIAL EXTENDED
Terminal Form
THROUGH-HOLE
J BEND
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
2
2
Clock Frequency-Max
77 MHz
JESD-609 Code
e0
Length
8.89 mm
Seated Height-Max
4.57 mm
Terminal Finish
TIN LEAD
Width
8.89 mm
Compare TIBPAL20L10-20CJT with alternatives
Compare PAL16R8-7VC with alternatives