TIBPAL20L10-20CJT
vs
TIBPAL20L8-30MJT
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
ROCHESTER ELECTRONICS LLC
Package Description
DIP, DIP24,.3
DIP,
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Architecture
PAL-TYPE
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
Number of Dedicated Inputs
12
14
Number of I/O Lines
8
6
Number of Inputs
20
Number of Outputs
10
Number of Product Terms
40
Number of Terminals
24
24
Operating Temperature-Max
75 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
12 DEDICATED INPUTS, 8 I/O
14 DEDICATED INPUTS, 6 I/O
Output Function
COMBINATORIAL
COMBINATORIAL
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programmable Logic Type
OT PLD
OT PLD
Propagation Delay
20 ns
30 ns
Qualification Status
Not Qualified
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL EXTENDED
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
2
2
ECCN Code
3A001.A.2.C
Compare TIBPAL20L10-20CJT with alternatives
Compare TIBPAL20L8-30MJT with alternatives