TGL41-11AC vs TGL41-11C feature comparison

TGL41-11AC Microsemi Corporation

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TGL41-11C International Semiconductor Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP INTERNATIONAL SEMICONDUCTOR INC
Part Package Code DO-213AB
Package Description O-PELF-N2
Pin Count 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Breakdown Voltage-Max 11.6 V 12.1 V
Breakdown Voltage-Min 10.5 V 9.9 V
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95 Code DO-213AB
JESD-30 Code O-PELF-N2 O-PELF-N2
JESD-609 Code e0
Non-rep Peak Rev Power Dis-Max 500 W 400 W
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity BIDIRECTIONAL BIDIRECTIONAL
Power Dissipation-Max 3 W 1 W
Qualification Status Not Qualified Not Qualified
Rep Pk Reverse Voltage-Max 9.4 V
Surface Mount YES YES
Technology AVALANCHE AVALANCHE
Terminal Finish TIN LEAD
Terminal Form WRAP AROUND NO LEAD
Terminal Position END END
Base Number Matches 1 2
Clamping Voltage-Max 16.2 V
Operating Temperature-Max 150 °C
Operating Temperature-Min -40 °C
Reverse Current-Max 5 µA

Compare TGL41-11AC with alternatives

Compare TGL41-11C with alternatives