TEA5500
vs
MC145027DW
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP,
|
SOP,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Consumer IC Type |
SUPPORT CIRCUIT
|
RECEIVER IC
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| Length |
21.68 mm
|
10.3 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
80 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.7 mm
|
2.65 mm
|
| Supply Voltage-Max (Vsup) |
6.5 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
| Surface Mount |
NO
|
YES
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Transmission Media |
INFRARED
|
|
| Width |
7.62 mm
|
7.5 mm
|
| Base Number Matches |
2
|
2
|
| JESD-609 Code |
|
e0
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare TEA5500 with alternatives
Compare MC145027DW with alternatives