TDA8594J/N1S
vs
TDA8595TH/N2S,112
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
ZIP
SOIC
Package Description
PLASTIC, SOT827-1, 27 PIN
SSOP, SSOP36,.5
Pin Count
27
36
Manufacturer Package Code
SOT827-1
SOT851-2
Reach Compliance Code
compliant
compliant
Factory Lead Time
4 Days
20 Weeks
Samacsys Manufacturer
NXP
NXP
Bandwidth-Nom
22 kHz
22 kHz
Consumer IC Type
AUDIO AMPLIFIER
AUDIO AMPLIFIER
Harmonic Distortion
10%
10%
JESD-30 Code
R-PZIP-T27
R-PDSO-G36
Number of Channels
4
4
Number of Functions
1
1
Number of Terminals
27
36
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Power-Nom
75 W
64 W
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
ZIP
SSOP
Package Equivalence Code
ZIP27,.16,.16,40
SSOP36,.5
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
225
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
400 mA
400 mA
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
8 V
8 V
Surface Mount
NO
YES
Technology
BCDMOS
BCDMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
1 mm
0.65 mm
Terminal Position
ZIG-ZAG
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Base Number Matches
1
1
Gain
26 dB
Length
15.9 mm
Moisture Sensitivity Level
1
Screening Level
AEC-Q100
Seated Height-Max
3.5 mm
Width
11 mm
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