TDA7056BU vs TDA7056AT feature comparison

TDA7056BU NXP Semiconductors

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TDA7056AT NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description SIP, 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP NXP
Consumer IC Type VOLUME CONTROL CIRCUIT VOLUME CONTROL CIRCUIT
JESD-30 Code R-PSIP-T9 R-PDSO-G20
Number of Terminals 9 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Surface Mount NO YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Position SINGLE DUAL
Base Number Matches 1 6
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 20
Harmonic Distortion 0.3%
Length 12.8 mm
Number of Channels 1
Number of Functions 1
Package Equivalence Code SOP20,.4
Peak Reflow Temperature (Cel) 260
Seated Height-Max 2.65 mm
Supply Current-Max 16 mA
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 40
Width 7.5 mm

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