TDA7056BU vs TDA7056A feature comparison

TDA7056BU NXP Semiconductors

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TDA7056A NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description SIP, PLASTIC, SOT110-1, SIP-9
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP
Consumer IC Type VOLUME CONTROL CIRCUIT VOLUME CONTROL CIRCUIT
JESD-30 Code R-PSIP-T9 R-PSFM-T9
Number of Terminals 9 9
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLANGE MOUNT
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Surface Mount NO NO
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Base Number Matches 1 9
Rohs Code Yes
Part Package Code SFM
Pin Count 9
Harmonic Distortion 0.3%
Number of Channels 1
Number of Functions 1
Package Equivalence Code SIP9,.1TB
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Current-Max 16 mA
Technology BIPOLAR
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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