TC74HCT688AP vs 5962-8685701RA feature comparison

TC74HCT688AP Toshiba America Electronic Components

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5962-8685701RA Texas Instruments

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Pbfree Code Yes Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TOSHIBA CORP TEXAS INSTRUMENTS INC
Part Package Code DIP DIP
Package Description DIP, DIP20,.3 CERAMIC, DIP-20
Pin Count 20 20
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-PDIP-T20 R-GDIP-T20
Length 24.6 mm 24.195 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type IDENTITY COMPARATOR MAGNITUDE COMPARATOR
Number of Bits 8 8
Number of Functions 1 8
Number of Terminals 20 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Propagation Delay (tpd) 40 ns 51 ns
Qualification Status Not Qualified Qualified
Seated Height-Max 4.45 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
ECCN Code EAR99
Additional Feature CASCADABLE
JESD-609 Code e0
Max I(ol) 0.004 A
Packing Method TUBE
Power Supply Current-Max (ICC) 0.08 mA
Prop. Delay@Nom-Sup 42 ns
Screening Level MIL-STD-883
Terminal Finish Tin/Lead (Sn/Pb)

Compare TC74HCT688AP with alternatives

Compare 5962-8685701RA with alternatives