TC74HCT688AP vs 933671010652 feature comparison

TC74HCT688AP Toshiba America Electronic Components

Buy Now Datasheet

933671010652 NXP Semiconductors

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP20,.3 DIP,
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-PDIP-T20 R-PDIP-T20
Length 24.6 mm 26.73 mm
Load Capacitance (CL) 50 pF
Logic IC Type IDENTITY COMPARATOR IDENTITY COMPARATOR
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Propagation Delay (tpd) 40 ns 51 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 4.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
JESD-609 Code e4
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

Compare TC74HCT688AP with alternatives

Compare 933671010652 with alternatives