TC74HCT688AP
vs
GD74HCT688J
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TOSHIBA CORP
GOLDSTAR ELECTRON CO LTD
Part Package Code
DIP
Package Description
DIP, DIP20,.3
,
Pin Count
20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
HCT
HCT
JESD-30 Code
R-PDIP-T20
R-CDIP-T20
Length
24.6 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
IDENTITY COMPARATOR
IDENTITY COMPARATOR
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
40 ns
42 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.45 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
Base Number Matches
1
2
Additional Feature
CASCADABLE
Compare TC74HCT688AP with alternatives
Compare GD74HCT688J with alternatives