TC74HC85SAP
vs
GD74HC85
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TOSHIBA CORP
GOLDSTAR ELECTRON CO LTD
Part Package Code
DIP
Package Description
DIP,
,
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
Length
19.25 mm
Logic IC Type
MAGNITUDE COMPARATOR
MAGNITUDE COMPARATOR
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
245 ns
49 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.45 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
2
Additional Feature
CASCADABLE
Load Capacitance (CL)
50 pF
Compare TC74HC85SAP with alternatives
Compare GD74HC85 with alternatives