GD74HC85
vs
74HC85N
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
GOLDSTAR ELECTRON CO LTD
NXP SEMICONDUCTORS
Package Description
,
PLASTIC, DIP-16
Reach Compliance Code
unknown
unknown
Additional Feature
CASCADABLE
CASCADABLE
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MAGNITUDE COMPARATOR
MAGNITUDE COMPARATOR
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
49 ns
59 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
3
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
16
ECCN Code
EAR99
HTS Code
8542.39.00.01
Samacsys Manufacturer
NXP
JESD-609 Code
e4
Length
21.6 mm
Package Equivalence Code
DIP16,.3
Seated Height-Max
4.7 mm
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare GD74HC85 with alternatives
Compare 74HC85N with alternatives