TC74HC573AF(TP1)
vs
MM74HC574WM
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TOSHIBA CORP
ROCHESTER ELECTRONICS INC
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP,
Pin Count
20
20
Reach Compliance Code
unknown
unknown
Additional Feature
BROADSIDE VERSION OF 373; ENABLE TIME @ RL=1K
BROADSIDE VERSION OF 374
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e0
e3
Length
12.8 mm
12.8015 mm
Load Capacitance (CL)
150 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
240
260
Propagation Delay (tpd)
39 ns
194 ns
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
1.9 mm
2.65 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
5.3 mm
7.5 mm
Base Number Matches
3
2
Moisture Sensitivity Level
1
Compare TC74HC573AF(TP1) with alternatives
Compare MM74HC574WM with alternatives