TC74HC573AF(TP1)
vs
MC74HC573AFELG
feature comparison
All Stats
Differences Only
Pbfree Code
No
Yes
Rohs Code
No
Yes
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TOSHIBA CORP
ONSEMI
Part Package Code
SOIC
SOIC
Package Description
SOP,
ROHS COMPLIANT, EIAJ,SO-20
Pin Count
20
20
Reach Compliance Code
unknown
unknown
Additional Feature
BROADSIDE VERSION OF 373; ENABLE TIME @ RL=1K
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e0
e4
Length
12.8 mm
12.575 mm
Load Capacitance (CL)
150 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
240
260
Propagation Delay (tpd)
39 ns
240 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.9 mm
2.05 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
5.3 mm
5.275 mm
Base Number Matches
1
1
HTS Code
8542.39.00.01
Factory Lead Time
4 Weeks
Max I(ol)
0.006 A
Package Equivalence Code
SOP20,.3
Packing Method
TR
Prop. Delay@Nom-Sup
45 ns
Compare TC74HC573AF(TP1) with alternatives
Compare MC74HC573AFELG with alternatives