TC74HC4052AF(TP2)
vs
CD54HCT4053F3A
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TOSHIBA CORP
HARRIS SEMICONDUCTOR
Part Package Code
SOIC
Package Description
SOP,
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
DIFFERENTIAL MULTIPLEXER
SPDT
JESD-30 Code
R-PDSO-G16
R-GDIP-T16
Length
10.3 mm
Neg Supply Voltage-Nom (Vsup)
-6 V
Number of Channels
4
1
Number of Functions
1
3
Number of Terminals
16
16
Off-state Isolation-Nom
50 dB
On-state Resistance Match-Nom
5 Ω
On-state Resistance-Max (Ron)
100 Ω
270 Ω
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.9 mm
Supply Current-Max (Isup)
0.08 mA
0.16 mA
Supply Voltage-Nom (Vsup)
6 V
Surface Mount
YES
NO
Switch-off Time-Max
43 ns
Switch-on Time-Max
38 ns
48 ns
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
5.3 mm
Base Number Matches
2
2
kg CO2e/kg
12.04
Average Weight (mg)
1187.4
CO2e (mg)
14296.296
Category CO2 Kg
12.04
Compliance Temperature Grade
Military: -55C to +125C
JESD-609 Code
e0
Package Equivalence Code
DIP16,.3
Signal Current-Max
0.025 A
Switching
BREAK-BEFORE-MAKE
Terminal Finish
TIN LEAD
Compare TC74HC4052AF(TP2) with alternatives
Compare CD54HCT4053F3A with alternatives