TC74ACT138P vs CD74HC237NSRE4 feature comparison

TC74ACT138P Toshiba America Electronic Components

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CD74HC237NSRE4 Texas Instruments

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Pbfree Code Yes Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP TEXAS INSTRUMENTS INC
Part Package Code DIP SOIC
Package Description DIP, DIP16,.3 SOP, SOP16,.3
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba
Family ACT HC/UH
Input Conditioning STANDARD LATCHED
JESD-30 Code R-PDIP-T16 R-PDSO-G16
Length 19.25 mm 10.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.024 A 0.004 A
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity INVERTED TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3 SOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Prop. Delay@Nom-Sup 11.5 ns 48 ns
Propagation Delay (tpd) 11.5 ns 240 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.45 mm 2 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 7.62 mm 5.3 mm
Base Number Matches 2 1
Additional Feature ADDRESS LATCHES; 3 ENABLE INPUTS
JESD-609 Code e4
Moisture Sensitivity Level 1
Packing Method TR
Terminal Finish NICKEL PALLADIUM GOLD

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Compare CD74HC237NSRE4 with alternatives