TC58DYG02A5TAI0 vs WS57C256F-70T feature comparison

TC58DYG02A5TAI0 Toshiba America Electronic Components

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WS57C256F-70T STMicroelectronics

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer TOSHIBA CORP STMICROELECTRONICS
Part Package Code TSOP DIP
Package Description TSSOP, WDIP, DIP28,.3
Pin Count 48 28
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.61
JESD-30 Code R-PDSO-G48 R-GDIP-T28
Length 18.4 mm 37.085 mm
Memory Density 1073741824 bit 262144 bit
Memory IC Type FLASH UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 28
Number of Words 134217728 words 32768 words
Number of Words Code 128000000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128MX8 32KX8
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code TSSOP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE, WINDOW
Parallel/Serial SERIAL PARALLEL
Programming Voltage 1.8 V 12.75 V
Seated Height-Max 1.2 mm 5.08 mm
Supply Voltage-Max (Vsup) 1.95 V 5.5 V
Supply Voltage-Min (Vsup) 1.7 V 4.5 V
Supply Voltage-Nom (Vsup) 1.8 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.5 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code No
Access Time-Max 70 ns
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code DIP28,.3
Qualification Status Not Qualified
Standby Current-Max 0.0002 A
Supply Current-Max 0.05 mA
Terminal Finish TIN LEAD
Width 7.62 mm

Compare TC58DYG02A5TAI0 with alternatives

Compare WS57C256F-70T with alternatives