TC58DYG02A5TAI0
vs
AM27X64-175JC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
TOSHIBA CORP
ADVANCED MICRO DEVICES INC
Part Package Code
TSOP
QFJ
Package Description
TSSOP,
QCCJ,
Pin Count
48
32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.71
JESD-30 Code
R-PDSO-G48
R-PQCC-J32
Length
18.4 mm
13.97 mm
Memory Density
1073741824 bit
65536 bit
Memory IC Type
FLASH
MASK ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
48
32
Number of Words
134217728 words
8192 words
Number of Words Code
128000000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
128MX8
8KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
QCCJ
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
CHIP CARRIER
Parallel/Serial
SERIAL
PARALLEL
Programming Voltage
1.8 V
Seated Height-Max
1.2 mm
3.556 mm
Supply Voltage-Max (Vsup)
1.95 V
5.25 V
Supply Voltage-Min (Vsup)
1.7 V
4.75 V
Supply Voltage-Nom (Vsup)
1.8 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
GULL WING
J BEND
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
DUAL
QUAD
Base Number Matches
1
1
Access Time-Max
170 ns
Output Characteristics
3-STATE
Qualification Status
Not Qualified
Width
11.43 mm
Compare TC58DYG02A5TAI0 with alternatives
Compare AM27X64-175JC with alternatives