TC58DYG02A5TAI0
vs
AM27X64-175JC
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
TOSHIBA CORP
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
TSOP
|
QFJ
|
| Package Description |
TSSOP,
|
QCCJ,
|
| Pin Count |
48
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.71
|
| JESD-30 Code |
R-PDSO-G48
|
R-PQCC-J32
|
| Length |
18.4 mm
|
13.97 mm
|
| Memory Density |
1073741824 bit
|
65536 bit
|
| Memory IC Type |
FLASH
|
MASK ROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
32
|
| Number of Words |
134217728 words
|
8192 words
|
| Number of Words Code |
128000000
|
8000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
128MX8
|
8KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
QCCJ
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER
|
| Parallel/Serial |
SERIAL
|
PARALLEL
|
| Programming Voltage |
1.8 V
|
|
| Seated Height-Max |
1.2 mm
|
3.556 mm
|
| Supply Voltage-Max (Vsup) |
1.95 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Base Number Matches |
1
|
1
|
| Access Time-Max |
|
170 ns
|
| Output Characteristics |
|
3-STATE
|
| Qualification Status |
|
Not Qualified
|
| Width |
|
11.43 mm
|
|
|
|
Compare TC58DYG02A5TAI0 with alternatives
Compare AM27X64-175JC with alternatives