TC534000CF vs KM23C4001HG-12 feature comparison

TC534000CF Toshiba America Electronic Components

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KM23C4001HG-12 Samsung Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code SOIC SOIC
Package Description 0.525 INCH, 1.27 MM PITCH, PLASTIC, SOP-32 SOP, SOP32,.56
Pin Count 32 32
Reach Compliance Code unknown unknown
Access Time-Max 120 ns 120 ns
JESD-30 Code R-PDSO-G32 R-PDSO-G32
JESD-609 Code e0 e0
Length 20.6 mm 20.47 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX8 512KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 3 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10.7 mm 11.43 mm
Base Number Matches 1 1
ECCN Code EAR99
HTS Code 8542.32.00.71
Package Equivalence Code SOP32,.56
Standby Current-Max 0.05 A
Supply Current-Max 0.05 mA

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