KM23C4001HG-12 vs HM23C4002M-12 feature comparison

KM23C4001HG-12 Samsung Semiconductor

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HM23C4002M-12 Hualon Microelectronics Corp

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC HUALON MICROELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP32,.56 SOP,
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 120 ns 150 ns
JESD-30 Code R-PDSO-G32 R-PDSO-G32
JESD-609 Code e0
Length 20.47 mm
Memory Density 4194304 bit 16777216 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX8 2MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP32,.56
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3 mm
Standby Current-Max 0.05 A
Supply Current-Max 0.05 mA 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Width 11.43 mm
Base Number Matches 1 1
Additional Feature PIN COMPATIBLE WITH 27C040

Compare KM23C4001HG-12 with alternatives

Compare HM23C4002M-12 with alternatives