TC4426AMPA
vs
TC426MJA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
TELCOM SEMICONDUCTOR INC
Package Description
DIP, DIP8,.3
DIP, DIP8,.3
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
JESD-30 Code
R-PDIP-T8
R-GDIP-T8
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
3
Rohs Code
High Side Driver
NO
Input Characteristics
STANDARD
Interface IC Type
BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-609 Code
e0
Number of Functions
2
Output Characteristics
TOTEM-POLE
Output Peak Current Limit-Nom
1.5 A
Output Polarity
INVERTED
Technology
CMOS
Terminal Finish
Tin/Lead (Sn/Pb)
Turn-off Time
0.075 µs
Turn-on Time
0.12 µs
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