TC4421EMFG
vs
IXDD509PI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
IXYS CORP
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Interface IC Type
BUFFER OR INVERTER BASED MOSFET DRIVER
BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-609 Code
e3
Terminal Finish
Matte Tin (Sn)
Base Number Matches
1
1
Part Package Code
DIP
Package Description
0.300 INCH, ROHS COMPLIANT, PLASTIC, MS-001BA, DIP-8
Pin Count
8
High Side Driver
NO
JESD-30 Code
R-PDIP-T8
Length
9.59 mm
Number of Functions
1
Number of Terminals
8
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Output Peak Current Limit-Nom
9 A
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Equivalence Code
DIP8,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
4.57 mm
Supply Voltage-Max
35 V
Supply Voltage-Min
4.5 V
Supply Voltage-Nom
18 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Turn-off Time
0.1 µs
Turn-on Time
0.1 µs
Width
7.62 mm
Compare TC4421EMFG with alternatives
Compare IXDD509PI with alternatives