TC4066BP
vs
HEF4066BD
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TOSHIBA CORP
|
PHILIPS COMPONENTS
|
Part Package Code |
DIP
|
|
Package Description |
DIP, DIP14,.3
|
,
|
Pin Count |
14
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Toshiba
|
|
Analog IC - Other Type |
SPST
|
SPST
|
JESD-30 Code |
R-PDIP-T14
|
|
Length |
19.25 mm
|
|
Normal Position |
NO
|
|
Number of Channels |
1
|
|
Number of Functions |
4
|
|
Number of Terminals |
14
|
|
On-state Resistance Match-Nom |
10 Ω
|
|
On-state Resistance-Max (Ron) |
950 Ω
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Output |
SEPARATE OUTPUT
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
DIP
|
|
Package Equivalence Code |
DIP14,.3
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
IN-LINE
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.45 mm
|
|
Supply Current-Max (Isup) |
0.03 mA
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
NO
|
|
Switch-on Time-Max |
120 ns
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
7.62 mm
|
|
Base Number Matches |
3
|
1
|
|
|
|
Compare TC4066BP with alternatives
Compare HEF4066BD with alternatives