HEF4066BD vs HEF4016BPB feature comparison

HEF4066BD YAGEO Corporation

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HEF4016BPB NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PHILIPS COMPONENTS NXP SEMICONDUCTORS
Package Description , DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST SPST
Qualification Status Not Qualified Not Qualified
Base Number Matches 3 1
JESD-30 Code R-PDIP-T14
Length 19.025 mm
Neg Supply Voltage-Nom (Vsup)
Number of Channels 1
Number of Functions 4
Number of Terminals 14
Off-state Isolation-Nom 50 dB
On-state Resistance Match-Nom 10 Ω
On-state Resistance-Max (Ron) 350 Ω
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Seated Height-Max 4.2 mm
Supply Current-Max (Isup) 0.03 mA
Supply Voltage-Nom (Vsup) 15 V
Surface Mount NO
Switch-off Time-Max 100 ns
Switch-on Time-Max 30 ns
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Compare HEF4066BD with alternatives

Compare HEF4016BPB with alternatives