HEF4066BD vs BU4016B feature comparison

HEF4066BD NXP Semiconductors

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BU4016B ROHM Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ROHM CO LTD
Part Package Code DIP DIP
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST SPST
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Neg Supply Voltage-Nom (Vsup)
Normal Position NO NO
Number of Channels 1 1
Number of Functions 4 4
Number of Terminals 14 14
Off-state Isolation-Nom 50 dB 50 dB
On-state Resistance Match-Nom 5 Ω 10 Ω
On-state Resistance-Max (Ron) 175 Ω 400 Ω
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output SEPARATE OUTPUT SEPARATE OUTPUT
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.55 mm
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Switch-off Time-Max 140 ns
Switch-on Time-Max 30 ns
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 3 1
Rohs Code No
JESD-609 Code e0
Length 19.4 mm
Terminal Finish TIN LEAD

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