SY89852UMG
vs
SY89208VMITR
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICREL INC
Package Description
MLF-16
HVSON, SOLCC8,.08,20
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Additional Feature
IT CAN ALSO OPERATE WITH 3.3 VOLT SUPPLY
ECL MODE: VCC = 0V WITH VEE = -3V TO -3.6V; ALSO OPERATES AT 5V SUPPLY
Family
89852
89208
JESD-30 Code
S-XQCC-N16
S-XDSO-N8
JESD-609 Code
e4
e0
Length
3 mm
2 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Moisture Sensitivity Level
2
2
Number of Functions
1
1
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
VQCCN
HVSON
Package Equivalence Code
LCC16,.12SQ,20
SOLCC8,.08,20
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, VERY THIN PROFILE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method
TUBE
TR
Peak Reflow Temperature (Cel)
260
240
Propagation Delay (tpd)
0.34 ns
420 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.95 mm
0.9754 mm
Supply Voltage-Max (Vsup)
2.625 V
3.6 V
Supply Voltage-Min (Vsup)
2.375 V
3 V
Supply Voltage-Nom (Vsup)
2.5 V
3.3 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Tin/Lead (Sn85Pb15)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
40
30
Width
3 mm
2 mm
Base Number Matches
2
2
Part Package Code
DFN
Pin Count
8
Manufacturer Package Code
MLF
Power Supply Current-Max (ICC)
50 mA
Prop. Delay@Nom-Sup
0.42 ns
Technology
ECL100K
Compare SY89852UMG with alternatives
Compare SY89208VMITR with alternatives