SY89852UMG vs SY5802UMITR feature comparison

SY89852UMG Microchip Technology Inc

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SY5802UMITR Microchip Technology Inc

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Rohs Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICREL INC
Package Description MLF-16 HVQCCN,
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature IT CAN ALSO OPERATE WITH 3.3 VOLT SUPPLY ALSO OPERATES WITH 3.3V SUPPLY
Family 89852
JESD-30 Code S-XQCC-N16 S-XQCC-N32
JESD-609 Code e4
Length 3 mm 5 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 2
Number of Functions 1 1
Number of Inputs 2 4
Number of Outputs 1 1
Number of Terminals 16 32
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code VQCCN HVQCCN
Package Equivalence Code LCC16,.12SQ,20 LCC32,.2SQ,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method TUBE TR
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 0.34 ns 0.34 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.95 mm 0.9 mm
Supply Voltage-Max (Vsup) 2.625 V 2.625 V
Supply Voltage-Min (Vsup) 2.375 V 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 3 mm 5 mm
Base Number Matches 3 2
Part Package Code DFN
Pin Count 32
Manufacturer Package Code MLF

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