SY89223LMGTR
vs
MC100ELT23D
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MOTOROLA INC
|
Part Package Code |
DFN
|
SOIC
|
Package Description |
MLF-8
|
SOP, SOP8,.25
|
Pin Count |
8
|
8
|
Manufacturer Package Code |
MLF
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Delay-Max |
2.5 ns
|
5.5 ns
|
Input Characteristics |
DIFFERENTIAL
|
DIFFERENTIAL
|
Interface IC Type |
PECL TO TTL TRANSLATOR
|
PECL TO TTL TRANSLATOR
|
JESD-30 Code |
S-XDSO-N8
|
R-PDSO-G8
|
JESD-609 Code |
e4
|
e0
|
Length |
2 mm
|
4.9 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Latch or Register |
NONE
|
NONE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
SOP
|
Package Equivalence Code |
SOLCC8,.08,20
|
SOP8,.25
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.9754 mm
|
1.75 mm
|
Supply Current-Max |
30 mA
|
|
Supply Voltage-Max |
3.6 V
|
|
Supply Voltage-Min |
3 V
|
|
Supply Voltage-Nom |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
2 mm
|
3.9 mm
|
Base Number Matches |
1
|
4
|
Output Characteristics |
|
TOTEM-POLE
|
Technology |
|
BIPOLAR
|
|
|
|
Compare SY89223LMGTR with alternatives
Compare MC100ELT23D with alternatives