MC100ELT23D
vs
SY89223LMITR
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
DFN
|
| Package Description |
SOP, SOP8,.25
|
MLF-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Delay-Max |
5.5 ns
|
2.5 ns
|
| Input Characteristics |
DIFFERENTIAL
|
DIFFERENTIAL
|
| Interface IC Type |
PECL TO TTL TRANSLATOR
|
PECL TO TTL TRANSLATOR
|
| JESD-30 Code |
R-PDSO-G8
|
S-XDSO-N8
|
| JESD-609 Code |
e0
|
|
| Length |
4.9 mm
|
2 mm
|
| Number of Bits |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
TOTEM-POLE
|
|
| Output Latch or Register |
NONE
|
NONE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SOP
|
HVSON
|
| Package Equivalence Code |
SOP8,.25
|
SOLCC8,.08,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.75 mm
|
0.9754 mm
|
| Supply Voltage-Nom |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
2 mm
|
| Base Number Matches |
4
|
2
|
| Manufacturer Package Code |
|
MLF
|
| Supply Current-Max |
|
30 mA
|
| Supply Voltage-Max |
|
3.6 V
|
| Supply Voltage-Min |
|
3 V
|
|
|
|
Compare MC100ELT23D with alternatives
Compare SY89223LMITR with alternatives