SY10EP89VZG
vs
MC10EP89D
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MOTOROLA INC
|
| Package Description |
LEAD FREE, PLASTIC, SOIC-8
|
PLASTIC, SOIC-8
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
20 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Additional Feature |
CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN ECL MODE
|
|
| Differential Output |
YES
|
YES
|
| Driver Number of Bits |
1
|
2
|
| High Level Input Current-Max |
0.00015 A
|
|
| Input Characteristics |
DIFFERENTIAL
|
DIFFERENTIAL
|
| Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
| Interface Standard |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e4
|
e0
|
| Length |
4.93 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.73 mm
|
1.75 mm
|
| Supply Voltage-Max |
3.465 V
|
|
| Supply Voltage-Min |
3.135 V
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Transmit Delay-Max |
0.42 ns
|
0.295 ns
|
| Width |
3.94 mm
|
3.9 mm
|
| Base Number Matches |
2
|
5
|
| Receive Delay-Max |
|
|
| Technology |
|
ECL
|
|
|
|
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