SY10EP53VKI vs MC10E156FNR2G feature comparison

SY10EP53VKI Microchip Technology Inc

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MC10E156FNR2G onsemi

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC ONSEMI
Part Package Code MSOP QLCC
Package Description MSOP-10 LEAD FREE, PLASTIC, LCC-28
Pin Count 10 28
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Microchip
Additional Feature NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V
Family 10E 10E
JESD-30 Code S-PDSO-G10 S-PQCC-J28
Length 3 mm 11.505 mm
Logic IC Type D FLIP-FLOP D LATCH
Number of Bits 1 3
Number of Functions 1 1
Number of Terminals 10 28
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP QCCJ
Package Shape SQUARE SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER
Propagation Delay (tpd) 0.35 ns 0.8 ns
Seated Height-Max 1.1 mm 4.57 mm
Supply Voltage-Max (Vsup) 5.5 V 5.7 V
Supply Voltage-Min (Vsup) 3 V 4.2 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology ECL ECL
Terminal Form GULL WING J BEND
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position DUAL QUAD
Trigger Type POSITIVE EDGE LOW LEVEL
Width 3 mm 11.505 mm
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
Manufacturer Package Code 776-02
ECCN Code EAR99
JESD-609 Code e3
Number of Inputs 4
Operating Temperature-Max 85 °C
Operating Temperature-Min
Output Characteristics OPEN-EMITTER
Package Equivalence Code LDCC28,.5SQ
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 90 mA
Prop. Delay@Nom-Sup 0.9 ns
Qualification Status Not Qualified
Temperature Grade OTHER
Terminal Finish TIN
fmax-Min 700 MHz

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