SY10EP53VKI
vs
SY10E256JCTR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICREL INC
SYNERGY SEMICONDUCTOR CORP
Part Package Code
MSOP
Package Description
TSSOP, TSSOP10,.19,20
Pin Count
10
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
Additional Feature
NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V
THREE 4:1 MUX FOLLOWED BY LATCH
Family
10E
10E
JESD-30 Code
S-PDSO-G10
S-PQCC-J28
JESD-609 Code
e0
e0
Length
3 mm
Logic IC Type
D FLIP-FLOP
D LATCH
Max Frequency@Nom-Sup
3000000000 Hz
Moisture Sensitivity Level
1
Number of Bits
1
3
Number of Functions
1
1
Number of Terminals
10
28
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
QCCJ
Package Equivalence Code
TSSOP10,.19,20
LDCC28,.5SQ
Package Shape
SQUARE
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
CHIP CARRIER
Peak Reflow Temperature (Cel)
240
Power Supply Current-Max (ICC)
47 mA
83 mA
Prop. Delay@Nom-Sup
0.4 ns
0.9 ns
Propagation Delay (tpd)
0.35 ns
0.8 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
YES
Technology
ECL
ECL
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
Tin/Lead (Sn85Pb15)
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
J BEND
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
POSITIVE EDGE
LOW LEVEL
Width
3 mm
Base Number Matches
2
2
Number of Inputs
4
Output Characteristics
OPEN-EMITTER
Packing Method
TR
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