SY100S364FC
vs
100371MD8
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICREL INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
QFP
Package Description
QFF, QFL24,.4SQ
DIE
Pin Count
24
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
100S
100K
JESD-30 Code
S-GQFP-F24
R-XUUC-N24
JESD-609 Code
e0
Length
9.78 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
1
3
Number of Inputs
16
4
Number of Outputs
1
1
Number of Terminals
24
24
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-55 °C
Output Polarity
TRUE
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
UNSPECIFIED
Package Code
QFF
DIE
Package Equivalence Code
QFL24,.4SQ
DIE OR CHIP
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK
UNCASED CHIP
Peak Reflow Temperature (Cel)
240
Power Supply Current-Max (ICC)
63 mA
Prop. Delay@Nom-Sup
1.4 ns
Propagation Delay (tpd)
1.4 ns
1.7 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.29 mm
Supply Voltage-Max (Vsup)
-5.5 V
Supply Voltage-Min (Vsup)
-4.2 V
Supply Voltage-Nom (Vsup)
-4.5 V
Surface Mount
YES
YES
Technology
ECL
ECL
Temperature Grade
OTHER
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
FLAT
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
QUAD
UPPER
Time@Peak Reflow Temperature-Max (s)
30
Width
9.78 mm
Base Number Matches
2
1
Compare SY100S364FC with alternatives
Compare 100371MD8 with alternatives