100371MD8
vs
100164Y
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
PHILIPS COMPONENTS
Package Description
DIE
,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
100K
100K
JESD-30 Code
R-XUUC-N24
S-GQFP-F24
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
3
1
Number of Inputs
4
16
Number of Outputs
1
1
Number of Terminals
24
24
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
Output Polarity
COMPLEMENTARY
TRUE
Package Body Material
UNSPECIFIED
CERAMIC, GLASS-SEALED
Package Code
DIE
QFP
Package Equivalence Code
DIE OR CHIP
QFL24,.4SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
UNCASED CHIP
FLATPACK
Propagation Delay (tpd)
1.7 ns
3.4 ns
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Technology
ECL
ECL
Temperature Grade
MILITARY
OTHER
Terminal Form
NO LEAD
FLAT
Terminal Position
UPPER
QUAD
Base Number Matches
2
2
Output Characteristics
OPEN-EMITTER
Power Supply Current-Max (ICC)
105 mA
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Compare 100164Y with alternatives