STM8AF6146TDXXXU
vs
DSPIC33FJ32GP302-E/TPT
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
STMICROELECTRONICS
MICROCHIP TECHNOLOGY INC
Part Package Code
QFP
QFP
Package Description
,
10 X 10 MM, 2 MM HEIGHT, LEAD FREE, PLASTIC, QFP-44
Pin Count
32
44
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
JESD-30 Code
S-PQFP-G32
S-PQFP-G44
Number of Terminals
32
44
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK, THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
GULL WING
GULL WING
Terminal Position
QUAD
QUAD
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
Pbfree Code
Rohs Code
ECCN Code
3A991.A.2
Address Bus Width
Bit Size
16
Clock Frequency-Max
40 MHz
External Data Bus Width
JESD-609 Code
e3
Length
10 mm
Moisture Sensitivity Level
3
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Package Code
TQFP
Peak Reflow Temperature (Cel)
260
ROM Programmability
FLASH
Seated Height-Max
1.2 mm
Supply Voltage-Max
3.6 V
Supply Voltage-Min
3 V
Supply Voltage-Nom
3.3 V
Temperature Grade
AUTOMOTIVE
Terminal Finish
Matte Tin (Sn)
Terminal Pitch
0.8 mm
Time@Peak Reflow Temperature-Max (s)
40
Width
10 mm
Compare STM8AF6146TDXXXU with alternatives
Compare DSPIC33FJ32GP302-E/TPT with alternatives