STM8AF6146TDXXXU
vs
MC9S08QE32CLD
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
STMICROELECTRONICS
FREESCALE SEMICONDUCTOR INC
Part Package Code
QFP
QFP
Package Description
,
10 X 10 MM, ROHS COMPLIANT, LQFP-44
Pin Count
32
44
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
JESD-30 Code
S-PQFP-G32
S-PQFP-G44
Number of Terminals
32
44
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK, LOW PROFILE
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
GULL WING
GULL WING
Terminal Position
QUAD
QUAD
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
3
Pbfree Code
Rohs Code
ECCN Code
3A991.A.2
Has ADC
YES
Additional Feature
OPERATES AT 2.4V TO 2.1V SUPPLY AT 40 MHZ, 2.1V TO 1.8V SUPPLY AT 20 MHZ
Address Bus Width
Bit Size
8
Clock Frequency-Max
16 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
JESD-609 Code
e3
Length
10 mm
Moisture Sensitivity Level
3
Number of I/O Lines
36
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
Package Code
LQFP
Package Equivalence Code
QFP44,.47SQ,32
Peak Reflow Temperature (Cel)
260
RAM (bytes)
2048
ROM (words)
32768
ROM Programmability
FLASH
Seated Height-Max
1.6 mm
Speed
50.33 MHz
Supply Voltage-Max
3.6 V
Supply Voltage-Min
1.8 V
Supply Voltage-Nom
3 V
Temperature Grade
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Pitch
0.8 mm
Time@Peak Reflow Temperature-Max (s)
40
Width
10 mm
Compare STM8AF6146TDXXXU with alternatives
Compare MC9S08QE32CLD with alternatives