Findchips: Compare SSTVF16859BS,157 vs IDT74SSTVM16859NL

SSTVF16859BS,157 vs IDT74SSTVM16859NL feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	No
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code	QFN	QFN
Package Description	HVQCCN, LCC56,.31SQ,20	HVQCCN, LCC56,.31SQ,20
Pin Count	56	56
Reach Compliance Code	unknown	not_compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	SSTV	SSTV
JESD-30 Code	S-PQCC-N56	S-PQCC-N56
JESD-609 Code	e4	e0
Length	8 mm	8 mm
Logic IC Type	D FLIP-FLOP	D FLIP-FLOP
Moisture Sensitivity Level	1	3
Number of Bits	13	13
Number of Functions	1	1
Number of Terminals	56	56
Operating Temperature-Max	70 °C	70 °C
Operating Temperature-Min
Output Polarity	TRUE	TRUE
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	HVQCCN	HVQCCN
Package Equivalence Code	LCC56,.31SQ,20	LCC56,.31SQ,20
Package Shape	SQUARE	SQUARE
Package Style	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)	260	240
Propagation Delay (tpd)	2.5 ns	2.9 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1 mm	1 mm
Supply Voltage-Max (Vsup)	2.7 V	2.7 V
Supply Voltage-Min (Vsup)	2.3 V	2.3 V
Supply Voltage-Nom (Vsup)	2.5 V	2.5 V
Surface Mount	YES	YES
Temperature Grade	COMMERCIAL	COMMERCIAL
Terminal Finish	Nickel/Palladium/Gold (Ni/Pd/Au)	TIN LEAD
Terminal Form	NO LEAD	NO LEAD
Terminal Pitch	0.5 mm	0.5 mm
Terminal Position	QUAD	QUAD
Time@Peak Reflow Temperature-Max (s)	30	30
Trigger Type	POSITIVE EDGE	POSITIVE EDGE
Width	8 mm	8 mm
fmax-Min	210 MHz	200 MHz
Base Number Matches	1	2
Technology		TTL
	Logic » FF/Latches	Logic » FF/Latches