SSTVF16859BS,157
vs
74SSTV16859NLG8
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFN
VFQFPN
Package Description
HVQCCN, LCC56,.31SQ,20
PLASTIC, MLF-56
Pin Count
56
56
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
SSTV
SSTV
JESD-30 Code
S-PQCC-N56
S-PQCC-N56
JESD-609 Code
e4
e3
Length
8 mm
8 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Moisture Sensitivity Level
1
3
Number of Bits
13
13
Number of Functions
1
1
Number of Terminals
56
56
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
VQCCN
Package Equivalence Code
LCC56,.31SQ,20
LCC56,.31SQ,20
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
2.5 ns
2.8 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1 mm
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
MATTE TIN
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
8 mm
8 mm
fmax-Min
210 MHz
200 MHz
Base Number Matches
1
1
Pbfree Code
Yes
Manufacturer Package Code
NLG56P3
Technology
TTL
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