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SSTVF16859BS,157 vs IDT74SSTV16859NLG8 feature comparison

SSTVF16859BS,157 NXP Semiconductors

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IDT74SSTV16859NLG8 Integrated Device Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFN DFN
Package Description HVQCCN, LCC56,.31SQ,20 HVQCCN, LCC56,.31SQ,20
Pin Count 56 56
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family SSTV SSTV
JESD-30 Code S-PQCC-N56 S-PQCC-N56
JESD-609 Code e4 e3
Length 8 mm 8 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 1 3
Number of Bits 13 13
Number of Functions 1 1
Number of Terminals 56 56
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN HVQCCN
Package Equivalence Code LCC56,.31SQ,20 LCC56,.31SQ,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 2.5 ns 2.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn) - annealed
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 8 mm 8 mm
fmax-Min 210 MHz 200 MHz
Base Number Matches 1 1
Pbfree Code Yes
Manufacturer Package Code MLF
Technology TTL
Logic » FF/Latches
Logic » FF/Latches

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