SSTUM32866EC/S
vs
SSTUB32866EC/G
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
LFBGA,
|
,
|
| Pin Count |
96
|
|
| Manufacturer Package Code |
SOT536-1
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
32866
|
|
| JESD-30 Code |
R-PBGA-B96
|
|
| Length |
13.5 mm
|
|
| Logic IC Type |
D FLIP-FLOP
|
|
| Moisture Sensitivity Level |
2
|
|
| Number of Bits |
25
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
96
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
OPEN-DRAIN
|
|
| Output Polarity |
COMPLEMENTARY
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFBGA
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
1.5 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.5 mm
|
|
| Supply Voltage-Max (Vsup) |
2 V
|
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Trigger Type |
POSITIVE EDGE
|
|
| Width |
5.5 mm
|
|
| fmax-Min |
550 MHz
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare SSTUM32866EC/S with alternatives