SSTUM32866EC/S vs SSTUA32866EC,551 feature comparison

SSTUM32866EC/S NXP Semiconductors

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SSTUA32866EC,551 NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code BGA BGA
Package Description LFBGA, LFBGA,
Pin Count 96 96
Manufacturer Package Code SOT536-1 SOT536-1
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 32866 32866
JESD-30 Code R-PBGA-B96 R-PBGA-B96
Length 13.5 mm 13.5 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 2
Number of Bits 25 14
Number of Functions 1 1
Number of Terminals 96 96
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min
Output Characteristics OPEN-DRAIN OPEN-DRAIN
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 1.5 ns 1.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.5 mm
Supply Voltage-Max (Vsup) 2 V 2 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.5 mm 5.5 mm
fmax-Min 550 MHz 450 MHz
Base Number Matches 1 1
JESD-609 Code e0
Terminal Finish TIN LEAD

Compare SSTUM32866EC/S with alternatives

Compare SSTUA32866EC,551 with alternatives