Findchips: Compare SSTUA32866EC,551 vs SSTUA32866EC

SSTUA32866EC,551 vs SSTUA32866EC feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	NXP SEMICONDUCTORS	PHILIPS SEMICONDUCTORS
Part Package Code	BGA
Package Description	LFBGA,	FBGA, BGA96,6X16,32
Pin Count	96
Manufacturer Package Code	SOT536-1
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	32866
JESD-30 Code	R-PBGA-B96	R-PBGA-B96
JESD-609 Code	e0	e0
Length	13.5 mm
Logic IC Type	D FLIP-FLOP	BUS DRIVER
Number of Bits	14
Number of Functions	1
Number of Terminals	96	96
Operating Temperature-Max	70 °C	70 °C
Operating Temperature-Min
Output Characteristics	OPEN-DRAIN
Output Polarity	COMPLEMENTARY
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LFBGA	FBGA
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, FINE PITCH
Propagation Delay (tpd)	1.8 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.5 mm
Supply Voltage-Max (Vsup)	2 V
Supply Voltage-Min (Vsup)	1.7 V
Supply Voltage-Nom (Vsup)	1.8 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	COMMERCIAL
Terminal Finish	TIN LEAD	Tin/Lead (Sn/Pb)
Terminal Form	BALL	BALL
Terminal Pitch	0.8 mm	0.8 mm
Terminal Position	BOTTOM	BOTTOM
Trigger Type	POSITIVE EDGE
Width	5.5 mm
fmax-Min	450 MHz
Base Number Matches	1	2
Rohs Code		No
Package Equivalence Code		BGA96,6X16,32
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