Findchips: Compare SSTU32866EC,518 vs ICSSSTUA32866BHMT

SSTU32866EC,518 vs ICSSSTUA32866BHMT feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	NXP SEMICONDUCTORS	INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code	BGA	BGA
Package Description	LFBGA,	11.50 X 5 MM, MO-205,TFBGA-96
Pin Count	96	96
Manufacturer Package Code	SOT536-1
Reach Compliance Code	unknown	not_compliant
HTS Code	8542.39.00.01	8542.39.00.01
Additional Feature	14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
Family	SSTU	SSTU
JESD-30 Code	R-PBGA-B96	R-PBGA-B96
Length	13.5 mm	11.5 mm
Logic IC Type	D FLIP-FLOP	D FLIP-FLOP
Number of Bits	25	25
Number of Functions	1	1
Number of Terminals	96	96
Operating Temperature-Max	70 °C	70 °C
Operating Temperature-Min
Output Characteristics	OPEN-DRAIN
Output Polarity	TRUE	TRUE
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LFBGA	TFBGA
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Propagation Delay (tpd)	1.8 ns	1.9 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.5 mm	1.2 mm
Supply Voltage-Max (Vsup)	1.9 V	1.9 V
Supply Voltage-Min (Vsup)	1.7 V	1.7 V
Supply Voltage-Nom (Vsup)	1.8 V	1.8 V
Surface Mount	YES	YES
Temperature Grade	COMMERCIAL	COMMERCIAL
Terminal Form	BALL	BALL
Terminal Pitch	0.8 mm	0.65 mm
Terminal Position	BOTTOM	BOTTOM
Trigger Type	POSITIVE EDGE	POSITIVE EDGE
Width	5.5 mm	5 mm
fmax-Min	450 MHz	410 MHz
Base Number Matches	1	1
Pbfree Code		No
Rohs Code		No
JESD-609 Code		e0
Package Equivalence Code		BGA96,6X16,25
Terminal Finish		TIN LEAD
	Logic » FF/Latches	Logic » FF/Latches