ICSSSTUA32866BHMT
vs
IDT74SSTUBF32865ABKG8
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
RENESAS ELECTRONICS CORP
Package Description
TFBGA,
LFBGA,
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
SSTU
SSTU
JESD-30 Code
R-PBGA-B96
R-PBGA-B160
JESD-609 Code
e0
e1
Length
11.5 mm
13 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
25
28
Number of Functions
1
1
Number of Terminals
96
160
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
LFBGA
Package Equivalence Code
BGA96,6X16,25
BGA160,12X18,25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd)
1.9 ns
1.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.3 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
BOTTOM
BOTTOM
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
5 mm
9 mm
fmax-Min
410 MHz
410 MHz
Base Number Matches
2
2
ECCN Code
EAR99
Moisture Sensitivity Level
3
Compare ICSSSTUA32866BHMT with alternatives
Compare IDT74SSTUBF32865ABKG8 with alternatives