ICSSSTUA32866BHMT vs SSTUA32864EC,518 feature comparison

ICSSSTUA32866BHMT Integrated Device Technology Inc

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SSTUA32864EC,518 NXP Semiconductors

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC NXP SEMICONDUCTORS
Part Package Code BGA BGA
Package Description 11.50 X 5 MM, MO-205,TFBGA-96 LFBGA,
Pin Count 96 96
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family SSTU SSTU
JESD-30 Code R-PBGA-B96 R-PBGA-B96
JESD-609 Code e0
Length 11.5 mm 13.5 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 25 25
Number of Functions 1 1
Number of Terminals 96 96
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Equivalence Code BGA96,6X16,25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd) 1.9 ns 1.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.5 mm
Supply Voltage-Max (Vsup) 1.9 V 2 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5 mm 5.5 mm
fmax-Min 410 MHz 450 MHz
Base Number Matches 2 1
Manufacturer Package Code SOT536-1

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Compare SSTUA32864EC,518 with alternatives