SST26WF064C-104I/MF
vs
W25Q64FWTBIG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
WINBOND ELECTRONICS CORP
Package Description
WDFN-8
8 X 6 MM, GREEN, TFBGA-24
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.1.A
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Date Of Intro
2016-06-01
Samacsys Manufacturer
Microchip
Clock Frequency-Max (fCLK)
104 MHz
104 MHz
Data Retention Time-Min
100
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-PDSO-N8
R-PBGA-B24
JESD-609 Code
e3
Length
6 mm
8 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
1
8
Number of Functions
1
1
Number of Ports
1
Number of Terminals
8
24
Number of Words
67108864 words
8388608 words
Number of Words Code
64000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64MX1
8MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
TBGA
Package Equivalence Code
SOLCC8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
GRID ARRAY, THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
1.8 V
1.8 V
Screening Level
TS 16949
Seated Height-Max
0.8 mm
1.2 mm
Serial Bus Type
SPI
Standby Current-Max
0.000015 A
Supply Current-Max
0.025 mA
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.65 V
1.65 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
NO LEAD
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
DUAL
BOTTOM
Type
NOR TYPE
Width
5 mm
6 mm
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
1
1
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