W25Q64FWTBIG
vs
SST26WF064CAT-104I/SO
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
8 X 6 MM, GREEN, TFBGA-24
|
SOIC-16
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
104 MHz
|
104 MHz
|
| JESD-30 Code |
R-PBGA-B24
|
R-PDSO-G16
|
| Length |
8 mm
|
10.3 mm
|
| Memory Density |
67108864 bit
|
67108864 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
16
|
| Number of Words |
8388608 words
|
67108864 words
|
| Number of Words Code |
8000000
|
64000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
8MX8
|
64MX1
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TBGA
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE
|
SMALL OUTLINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Programming Voltage |
1.8 V
|
1.8 V
|
| Seated Height-Max |
1.2 mm
|
2.65 mm
|
| Supply Voltage-Max (Vsup) |
1.95 V
|
1.95 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Width |
6 mm
|
7.5 mm
|
| Base Number Matches |
1
|
1
|
| Date Of Intro |
|
2016-06-01
|
| Screening Level |
|
TS 16949
|
|
|
|
Compare W25Q64FWTBIG with alternatives
Compare SST26WF064CAT-104I/SO with alternatives