SI7450DP-T1-GE3
vs
FQD12N20TM
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
VISHAY SILICONIX
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
SOT
DPAK
Package Description
SMALL OUTLINE, R-XDSO-C5
DPAK-3
Pin Count
8
3
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
Case Connection
DRAIN
DRAIN
Configuration
SINGLE WITH BUILT-IN DIODE
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min
200 V
200 V
Drain Current-Max (ID)
3.2 A
9 A
Drain-source On Resistance-Max
0.09 Ω
0.28 Ω
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
JESD-30 Code
R-XDSO-C5
R-PSSO-G2
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
5
2
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Operating Temperature-Max
150 °C
150 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Power Dissipation-Max (Abs)
5.2 W
55 W
Pulsed Drain Current-Max (IDM)
40 A
36 A
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Finish
Matte Tin (Sn) - annealed
MATTE TIN
Terminal Form
C BEND
GULL WING
Terminal Position
DUAL
SINGLE
Time@Peak Reflow Temperature-Max (s)
30
30
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
2
2
Rohs Code
Manufacturer Package Code
TO252 (D-PAK), MOLDED, 3 LEAD,OPTION AA&AB
HTS Code
8541.29.00.95
Avalanche Energy Rating (Eas)
210 mJ
JEDEC-95 Code
TO-252
Compare SI7450DP-T1-GE3 with alternatives
Compare FQD12N20TM with alternatives